| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a lead frame which is composed of an inner lead having a bonding pad part, an outer lead as an external terminal, a die pad for mounting a semiconductor element thereon, and a suspension lead for supporting the die pad, prevents deformation of the inner lead and electrical short-circuit, and has superior wire bondability. <P>SOLUTION: At least the bonding pad and the tips of the inner leads 2 on the opposite surface are fixed by ceramics 11 via a wax material so that respective inner leads 2 stand in a row. <P>COPYRIGHT: (C)2012,JPO&INPIT |
