| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide methods and an apparatus that are improved to clean an edge of a substrate. <P>SOLUTION: The apparatus and methods adapted to polish an edge of the substrate include: a polishing film; a frame 502 adapted to apply a tension and a load on the polishing film so that at least a portion of the film is supported in a plane; and a substrate rotation driver 510 adapted to rotate a substrate against the plane of the polishing film such that the polishing film is adapted to apply force to the substrate, contour to the edge of the substrate, the edge including at least an outer edge and a first bevel, and polish the outer edge and the first bevel as the substrate is rotated. <P>COPYRIGHT: (C)2012,JPO&INPIT |
