发明名称 ELECTRONIC COMPONENT
摘要 <P>PROBLEM TO BE SOLVED: To provide an electronic component in which a sealing resin formed so as to cover an electronic component element is prevented from being charged. <P>SOLUTION: An electronic component comprises: a mounting substrate 10; a surface acoustic wave element 20 mounted on the mounting substrate 10; a sealing resin 40 formed so as to cover the surface acoustic wave element 20 mounted on the mounting substrate 10; and a conductive layer 50 formed on a surface of the sealing resin 40. The conductive layer 50 has a lower electric resistance value than the sealing resin 40. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012186634(A) 申请公布日期 2012.09.27
申请号 JP20110048012 申请日期 2011.03.04
申请人 MURATA MFG CO LTD 发明人 OTSUBO AKIRA;KONOMA TOMOHIRO
分类号 H03H9/25 主分类号 H03H9/25
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