发明名称 WIRING BOARD
摘要 A wiring board includes: a first wiring; a second wiring being disposed adjacently to the first wiring; a third wiring being disposed adjacently to the first wiring; a fourth wiring being disposed adjacently to the third wiring; and an insulating layer, wherein the second wiring and the fourth wiring are disposed adjacently to each other, the first wiring and the fourth wiring are not overlapped, the second wiring and the third wiring are not overlapped, a crest and a trough are provided on a side face of the first wiring, the crest and the trough are provided on a side face of the second wiring, the trough provided on the side face of the first wiring and the third wiring are overlapped, and the trough provided on the side face of the second wiring and the fourth wiring are overlapped.
申请公布号 US2012241197(A1) 申请公布日期 2012.09.27
申请号 US201113328351 申请日期 2011.12.16
申请人 HIRAOKA TETSUYA;FUJITSU SEMICONDUCTOR LIMITED 发明人 HIRAOKA TETSUYA
分类号 H05K1/02 主分类号 H05K1/02
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