发明名称 METHOD FOR FORMING OXIDE SEMICONDUCTOR FILM AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
摘要 A method for forming an oxide semiconductor film having favorable semiconductor characteristics is provided. In addition, a method for manufacturing a semiconductor device having favorable electric characteristics, with use of the oxide semiconductor film is provided. A method for forming an oxide semiconductor film including the steps of forming an oxide semiconductor film, forming a hydrogen permeable film over and in contact with the oxide semiconductor film, forming a hydrogen capture film over and in contact with the hydrogen permeable film, and releasing hydrogen from the oxide semiconductor film by performing heat treatment. Further, in a method for manufacturing a semiconductor device, the method for forming an oxide semiconductor film is used.
申请公布号 US2012244659(A1) 申请公布日期 2012.09.27
申请号 US201213422241 申请日期 2012.03.16
申请人 IMOTO YUKI;MARUYAMA TETSUNORI;TAKAYAMA TORU;SEMICONDUCTOR ENERGY LABORATORY CO., LTD. 发明人 IMOTO YUKI;MARUYAMA TETSUNORI;TAKAYAMA TORU
分类号 H01L21/42 主分类号 H01L21/42
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