| 摘要 |
<p>Provided are a method for forming copper wiring, a method for manufacturing a wiring substrate, and a wiring substrate, which are capable of improving the conductivity of the copper wiring and suppressing deterioration over time. The method for forming copper wiring includes: a wiring pattern forming step for applying, upon a substrate (10), a first suspension (12) with first copper particles (14) dispersed therein having an average particle size of at least 100 nm, and forming a wiring pattern upon the substrate (10) using the first suspension (12); a drying step for drying the first copper particles (14) at a temperature lower than 150°C; a second suspension application step for applying, to the wiring pattern, a second suspension (16) with second copper particles (18) dispersed therein having a smaller average particle size than the average particle size of the first copper particles (14); a compacting step for reducing the spaces between the first and second copper particles (14, 18); a heating step for heating the first and second copper particles (14, 18); and a reduction treatment step for reducing the first and second copper particles (14, 18).</p> |
