| 摘要 |
<P>PROBLEM TO BE SOLVED: To highly precisely perform defect inspection of a subject (work-piece) in a compact device structure. <P>SOLUTION: An imaging device 10 is used which is provided with a lens array 11 in which a plurality of lenses are arrayed; and an imaging element 14 which images a compound-eye image as an assembly of a reduction image (single-eye image) of an object to be imaged which is approximately formed by each of the plurality of lenses of the lens array. In a processing device 20, the compound-eye image obtained by imaging the object to be imaged by the imaging device 10 is processed to determine the flaw of the subject. Here, the processing device 20 comprises: an image capture section 21 which separates the compound-eye image obtained by the imaging device 10 into a plurality of single-eye images; an image correction section 22 in which each of the plurality of separated single-eye images is distorted and corrected; and a defect determination section 23 which determines the flaw of the subject based on the plurality of distorted and corrected single-eye images. <P>COPYRIGHT: (C)2012,JPO&INPIT |
