| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a workpiece dividing device capable of preventing chip quality deterioration caused by a slack dicing tape, and a workpiece dividing method. <P>SOLUTION: A workpiece dividing device for dividing a workpiece attached to a dicing tape via a die-attach film into individual chips along a parting schedule line formed in advance comprises: selective cooling means for selectively cooling a workpiece composed of semiconductor wafers having the parting schedule line and a region of the dia-attach film including the parting schedule line of the workpiece attached to the die-attach film; workpiece dividing means for dividing the workpiece and the die-attach film by expanding the dicing tape after the cooling; and heating means for eliminating a slack caused by the expanded dicing tape by heating portions other than the region to which the workpiece of the dicing tape was attached via the die-attach film. <P>COPYRIGHT: (C)2012,JPO&INPIT |
