| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a piezoelectric vibrating reed manufacturing method, a piezoelectric vibrating reed manufacturing apparatus, a piezoelectric vibrating reed, a piezoelectric transducer provided with the piezoelectric vibrating reed, an oscillator, an electronic apparatus and an atomic clock, which can inhibit unevenness of a film thickness when depositing a mask material film on a square wafer. <P>SOLUTION: A piezoelectric vibrating reed manufacturing method includes a photoresist film deposition step (mask material film deposition step) of performing deposition by a spin coating method. In a deposition apparatus, a plurality of concentrically circular grooves 90 and a plurality of walls 95 adjacent to each other in a radial direction of each of the grooves 90 are formed on a top face 88a of a current plate 88. A diameter of an outer surface 91a of a first groove 91 among the plurality of grooves 90 is formed smaller than the longest distance α among distances from a rotation center K to an outer edge 66 of a square wafer 65, and larger than the shortest distance β among distances from the rotation center K to the outer edge 66 of the square wafer 65. A diameter of an outer surface 92a of a second groove 92 among the plurality of grooves 90 is formed smaller than the shortest distance β among distances from the rotation center K to the outer edge 66 of the square wafer 65. <P>COPYRIGHT: (C)2012,JPO&INPIT |
