COMPOSITE MEMBER PROVIDED WITH SUBSTRATE FORMED FROM COMPOSITE MATERIAL

摘要

A composite member (1a) has a substrate (2) formed from a composite material that combines magnesium or a magnesium alloy and SiC. The displacement of the surface for one surface of the composite member (1a) along the longest side thereof is measured, and letting lmax be the difference between the maximum value and the minimum value for the measured displacement and Dmax be the length of the longest side, the degree of warpage defined by lmax/Dmax is 0.01 x 10-3 - 10 x 10-3. Thus, a composite member that can dissipate heat efficiently to an object on which the same is mounted, a heat dissipating member that uses this composite member, and a semiconductor device that has this heat dissipating member are provided.