| 摘要 |
According to the embodiment, a sputtering device and a sputtering method includes: a target of which a bottom surface is arranged so as to be opposed to a wafer substrate; a magnetic field forming portion which is arranged to be opposed to an upper surface of the target, and includes a magnet forming a magnetic field; a mechanism which changes a distance from a center point on a surface of the target opposed to the wafer substrate to a predetermined reference point of the magnetic field forming portion, while making the magnetic field forming portion go around the center point, with maintaining a spacing between the target and the magnetic field forming portion; and a wafer retaining portion which is capable of arranging the wafer substrate at a predetermined position. |
