| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device which allows pillars to be disposed securely, and to provide a manufacturing method of the semiconductor device. <P>SOLUTION: A semiconductor device 30 according to one embodiment of this invention includes: a semiconductor chip 1 including an inner circuit region 20 and an I/O region 10 provided at the outer side of the inner circuit region 20; a package substrate 6 connecting with the semiconductor chip 1 through a flip-flop method; and conductive pillars 4, each of which is disposed between the semiconductor chip 1 and the package substrate 6, is formed on two or more ground wirings 12a included in an uppermost layer wiring layer 12 of the semiconductor chip 1, connects the two or more ground wirings 12a with each other. <P>COPYRIGHT: (C)2012,JPO&INPIT |
