发明名称 SOI SUBSTRATE AND MANUFACTURING METHOD FOR THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To provide a manufacturing method for an SOI substrate which prevents a semiconductor film such as a single-crystal silicon film from separating off from a support substrate, and improve the yield and reduce the production cost in manufacture of the SOI substrate by employing this method. <P>SOLUTION: A manufacturing method for an SOI substrate includes: forming an insulation film on a semiconductor substrate; irradiating the semiconductor substrate with accelerated ions to form an embrittled region in the semiconductor substrate; attaching the semiconductor substrate and a support substrate to each other with the insulation film interposed therebetween; separating the semiconductor substrate at the embrittled region to form a semiconductor film on the support substrate with the insulation film interposed therebetween; forming a mask on the semiconductor film; and etching a part of the semiconductor film and a part of the insulation film to form the semiconductor film and the insulation film so that a peripheral part of the semiconductor film is located inside a peripheral part of the insulation film. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012186459(A) 申请公布日期 2012.09.27
申请号 JP20120029022 申请日期 2012.02.14
申请人 SEMICONDUCTOR ENERGY LAB CO LTD 发明人 NAGAI MASAHARU;ONUMA HIDETO;NEI TAKAMASA
分类号 H01L27/12;H01L21/02;H01L21/20;H01L21/265 主分类号 H01L27/12
代理机构 代理人
主权项
地址