发明名称 THERMOPLASTIC RESIN COMPOSITION, RESIN MOLDING, AND PROCESS FOR PRODUCING RESIN MOLDING HAVING PLATING LAYER ATTACHED THERETO
摘要 <p>Provided is a thermoplastic resin molding, which has excellent bending strength, bending elastic modulus and Charpy impact strength, and on the surface of which a plating can be formed properly. A thermoplastic resin composition for laser direct structuring, which comprises 100 parts by weight of a thermoplastic resin, 10-150 parts by weight of inorganic fibers and 1-30 parts by weight of a laser direct structuring additive, wherein the laser direct structuring additive comprises at least one component selected from copper, antimony and tin and the Mohs's hardness of the laser direct structuring additive is 1.5 or more smaller than that of the inorganic fibers.</p>
申请公布号 WO2012128219(A1) 申请公布日期 2012.09.27
申请号 WO2012JP56886 申请日期 2012.03.16
申请人 MITSUBISHI CHEMICAL EUROPE GMBH;MITSUBISHI ENGINEERING-PLASTICS CORPORATION;TAKANO TAKAHIRO;SUMINO TAKAHIKO;ISHIHARA KENTAROU;SCHRAUWEN, BERNARDUS ANTONIUS GERARDUS 发明人 TAKANO TAKAHIRO;SUMINO TAKAHIKO;ISHIHARA KENTAROU;SCHRAUWEN, BERNARDUS ANTONIUS GERARDUS
分类号 C23C18/20;C08K3/00;C08L77/00;C08L101/00;C23C18/16;H05K3/18 主分类号 C23C18/20
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