发明名称 SEMICONDUCTOR MANUFACTURING APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To provide a semiconductor manufacturing apparatus which inhibits powder particles from occurring when cleaning inside a vertical reaction furnace by using a cleaning gas or during deposition. <P>SOLUTION: According to an embodiment, a semiconductor manufacturing apparatus comprises: a vertically movable rotation structure including a lower connection part 5 fixed to a rotation axis of a motor 6, an upper connection part 4 fixed on the lower connection part 5 and a boat 2 fixed on the upper connection part 4 for supporting a processing target substrate 10; and a reaction tube 1 forming a reaction chamber housing the rotation structure. The upper connection part 4 is composed of a material having a coefficient of thermal expansion between a coefficient of thermal expansion of the lower connection part 5 and a coefficient of thermal expansion of the boat 2. The upper connection part 4 is coated with a coating film having corrosion resistance against a cleaning gas and a reaction gas used in the processing chamber. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012186286(A) 申请公布日期 2012.09.27
申请号 JP20110047809 申请日期 2011.03.04
申请人 TOSHIBA CORP 发明人 NAKAO TAKASHI;TAKANO KENSUKE
分类号 H01L21/31;C23C16/44;H01L21/3065 主分类号 H01L21/31
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