发明名称 |
LIGHT EMITTING DIODE, MANUFACTURING METHOD THEREOF, LIGHT EMITTING DIODE MODULE, AND MANUFACTURING METHOD THEREOF |
摘要 |
A manufacturing method of a light emitting diode (LED) and a manufacturing method of an LED module are provided. The manufacturing method of the LED may include manufacturing a plurality of LED chips, manufacturing a phosphor pre-form including a plurality of mounting areas for mounting the plurality of LED chips, applying an adhesive inside the phosphor pre-form, mounting each of the plurality of LED chips in each of the plurality of mounting areas, and cutting the phosphor pre-form to which the plurality of LED chips are mounted, into units including individual LED chips.
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申请公布号 |
US2012241797(A1) |
申请公布日期 |
2012.09.27 |
申请号 |
US201213428726 |
申请日期 |
2012.03.23 |
申请人 |
KIM HAK HWAN;KIM MIN JUNG;MOON KYUNG MI;SONG JONG SUP;YOU JAE SUNG;CHOI ILL HEOUNG;YOO CHEOL JUN |
发明人 |
KIM HAK HWAN;KIM MIN JUNG;MOON KYUNG MI;SONG JONG SUP;YOU JAE SUNG;CHOI ILL HEOUNG;YOO CHEOL JUN |
分类号 |
H01L33/50 |
主分类号 |
H01L33/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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