PLATING FILM, ELECTRONIC PART, PLATING LIQUID, AND METHOD FOR FORMING PLATING FILM

摘要

PROBLEM TO BE SOLVED: To provide a plating film having a high hardness and a low resistance, an electronic part having the plating film as an electric contact, a plating liquid capable of forming the plating film, and a method for forming the plating film.

SOLUTION: The plating film 10 comprises Au(100-x-y)-Mx-Cy, wherein M is a metal element other than Au; and x and y satisfy the relations: 1≤x≤22, 3≤y≤30 and 4≤(x+y)≤40. The plating liquid 50 contains Au ions, Ni ions, citrate (Cit) ions and CN ions.

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