PASSIVATION LAYER FOR SEMICONDUCTOR DEVICE PACKAGING

摘要

OF THE DISCLOSUREPASSIVATION LAYER FOR SEMICONDUCTOR DEVICE PACKAGINGMethods of protecting a surface of a copper layer or a copper bonding pad on a semiconductor device against oxidation. A surface of the layer or bonding pad is cleaned by removing an oxidation layer with a plasma. A polymer layer is formed on the cleaned surface of the layer using a plasma-enhanced deposition process to protectthe cleaned surface of the layer against exposure to an oxidizing gas.FIG. 1