发明名称 WAFER AND CRYSTAL GROWTH METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide a wafer having a high-quality crystal formed on a substrate of silicon or the like, and to provide a crystal growth method and a semiconductor device. <P>SOLUTION: In an embodiment, a wafer including a substrate, a base layer, an underlayer, an intermediate layer and a functional part is provided. The base layer is provided on the main surface of the substrate, and contains a silicon compound. The underlayer is provided on the base layer, and contains GaN. The intermediate layer is provided on the underlayer, and contains a layer containing AIN. The functional part is provided on the intermediate layer, and contains a nitride semiconductor. The concentration of silicon atoms in a first region on the base layer side of the underlayer is higher than the concentration of silicon atoms in a second region on the intermediate layer side of the underlayer. The underlayer has a plurality of voids provided in the first region. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012184121(A) 申请公布日期 2012.09.27
申请号 JP20110046424 申请日期 2011.03.03
申请人 TOSHIBA CORP 发明人 SHIODA MICHIYA;SUGIYAMA NAOHARU;NUNOGAMI SHINYA
分类号 C30B29/38;C23C16/34;H01L21/205 主分类号 C30B29/38
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