| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing an electronic circuit device by newly finding a sealing method that can be materialized with a small quantity of resin and can cope with circuit boards having various component disposition. <P>SOLUTION: In this method of manufacturing the electronic circuit device, a liquefied resin material 30 is introduced into a casing 11 for housing a circuit board 12 mounted with electronic components 13; the surface of the introduced resin material 30 is covered with a cover member 20 to be pushed-in; and the resin material 30 is cured after partially pushing it up. The cover member 20 formed so as to cover the circuit board 12 mounted with the electronic components 13 has a hole through which the liquefied resin material 30 can pass at a position corresponding to the tallest electronic component 13 mounted to the circuit board 12, and when the surface of the resin material 30 is pushed-in by the cover member 20, the liquefied resin material 30 seals the electronic components 13 and the surplus resin material 30 flows out from the hole. <P>COPYRIGHT: (C)2012,JPO&INPIT |
