发明名称 Substrate with contacted electrically conductive structures and method for producing same
摘要 <p>An electrically conductive structure (3) is applied on the surface (1b) of a flexible substrate (1), and the substrate is cut along the region of conductive structure in a direction oblique to the first surface. An electrically conductive structure (2) is applied on the surface (1a) of the substrate, such that the electrically conductive structure (2) comes into contact with the other electrically conductive structure and electrically connects the opposing surfaces of substrate. An independent claim is included for substrate.</p>
申请公布号 EP2503862(A1) 申请公布日期 2012.09.26
申请号 EP20120002024 申请日期 2012.03.22
申请人 GIESECKE & DEVRIENT GMBH 发明人 WELLING, ANDO, DR.
分类号 H05K3/40;G06K19/077;H05K3/00;H05K3/42 主分类号 H05K3/40
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