发明名称 Heat pump system
摘要 <p>One aspect of the present invention may include a heat pump system (1) having a Peltier unit (10) installed in an outdoor space (1b), an outdoor heat exchange unit (12) installed in the outdoor space (1b) and connected to the Peltier unit (10) via an outdoor piping (17, 18) in a loop-like fashion to effect heat exchange with the air in the outdoor space (1b) and an indoor heat exchange unit (13) provided in an indoor space (1a) and connected to the Peltier unit (10) in a loop-like fashion by an indoor piping (19) to effect heat exchange with an air in the indoor space (1a). The Peltier unit (10) has a Peltier element (2), a first substrate (3), a second substrate (4), a metal case (6) and a resin case (7). The Peltier element (2) is equipped with a first heat surface and a second heat surface. One surface constitutes a heat-absorbing portion, while the other surface constitutes a heat-radiating portion. The first substrate (3) is in contact with the first heat surface. The second substrate (4) is in contact with the second heat surface. The metal case (6) covers the first substrate (3) and forms a first flow path (6a3) between itself and the first substrate (3). The first flow path (6a3) is connected in a loop-like fashion to the outdoor heat exchange unit (12) by the outdoor piping (17, 18). The resin case (7) covers the second substrate (4) and forms a second flow path (7a3) between itself and the second substrate (4). The second flow path (7a3) is connected in a loop-like fashion to the indoor heat exchange unit (13) by the indoor piping (19).</p>
申请公布号 EP2503263(A2) 申请公布日期 2012.09.26
申请号 EP20120159809 申请日期 2012.03.16
申请人 KABUSHIKI KAISHA TOYOTA JIDOSHOKKI 发明人 UEDA, HIROMI;YOKOMACHI, NAOYA;OKUDA, MOTOAKI;NAKAMURA, JUNKI
分类号 F25B21/02 主分类号 F25B21/02
代理机构 代理人
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