| 摘要 |
PURPOSE: A semiconductor package and a manufacturing method thereof are provided to reduce the entire thickness of the semiconductor package by burying a bump on an insulating layer to mount a chip. CONSTITUTION: A first circuit layer(101a,101b) is formed on both sides of a core insulating layer(100). A first insulating layer(102a,102b) includes a second circuit layer(107a,107b) with a second bump pad. The first insulating layer has a first open section and a second open section to form a connection via(106a,106b). A first bump(112) is formed on the first open section. A first chip(110) is formed on the first bump.
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