发明名称 COOLING APPARATUS USING THERMOELEMENT MODULE
摘要 PURPOSE: A cooling device using a thermoelectric module is provided to improve the cooling efficiency by optimizing fluid paths for heat exchanging. CONSTITUTION: A cooling device using a thermoelectric module comprises a first housing(100), a second housing(200), a thermoelectric module unit(300), a first air flow generator, a second air flow generator(240). The first housing comprises an air inlet, an air outlet, and a first fluid path which connects the air inlet and outlet. The second housing connected to the first housing forms the air inlet and outlet, and comprises a second fluid path which connects the air inlet and outlet. The thermoelectric module unit comprises a pair of substrates, a thermoelectric module, a first heat exchanger, and a second heat exchanger. The first air flow generator installed in the firs housing forms the air flow in the first fluid path. The second flow generator installed in the second housing forms the air flow in the second fluid path.
申请公布号 KR101185567(B1) 申请公布日期 2012.09.26
申请号 KR20120018361 申请日期 2012.02.23
申请人 VORTEX SEMICONDUCTOR INC. 发明人 PARK, SE HOON;YOON, JIN WON;PYO, SOO HWAN
分类号 F25B21/02;F24F5/00;F28D15/02 主分类号 F25B21/02
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