发明名称 DIE SHUTTLE AND PARTS SUPPLY METHOD USING THE DIE SHUTTLE
摘要 PURPOSE: A die shuttle and a component supply method using the same are provided to differently form the number of pockets and the distance between pockets in each die plate. CONSTITUTION: A die shuttle includes a link structure(1200), a single pocket die plate(400), an adjusting unit and a supporting board. The link structure includes a plurality of X shaped links with a hinge-coupled central part and a plurality of connection links. The single pocket die plate is located on a combination unit between each central part of the link structure and the connection link. The single pocket die plate includes one pocket corresponding to the space for receiving a component(600). The adjusting unit adjusts the distance between the single pocket die plates by adjusting the distance between the central parts of the link structure.
申请公布号 KR20120105861(A) 申请公布日期 2012.09.26
申请号 KR20110023547 申请日期 2011.03.16
申请人 SAMSUNG TECHWIN CO., LTD. 发明人 PARK, SEONG MAN
分类号 H05K13/02;H05K13/04 主分类号 H05K13/02
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