| 摘要 |
The invention relates to a method and an apparatus for producing an inlay for a film composite, and to a film composite, in particular for further processing for example to form a smart card, wherein a carrier film (12) with a plurality of electronic components (17, 18) arranged thereon and assigned to one another is fed to an image acquisition device (23), which detects the position of an electronic component (17, 18) as panel (16), wherein a laser-sensitive compensating film (14) to be applied on the carrier film (12) is firstly fed to a laser cutting device (27), wherein the data acquired by the image acquisition device (23) containing the position of the respective electronic component (17, 18) on the carrier film (12) are communicated to the laser cutting device (27) and the laser cutting device (27) is driven for the production of cutouts (28) adapted to the respective position of the electronic components (17, 18), wherein the compensating film (14) with the cutouts (28) introduced thereon and the carrier material (12) are combined in a combining station (34) and are fixed in a manner aligned with register accuracy with respect to one another to form an inlay (36), wherein, by means of the laser cutting device (27) for the production of the cutouts (28), by means of a further laser cutting device or by means of a marking device (30), for each panel (16) or a group of panels (16), a control mark (32) is applied to the compensating film (14) in a manner dependent on the respective detected position of the electronic component (17, 18) on the carrier film (12). |
