发明名称 HIGH-SPEED RFID CIRCUIT PLACEMENT METHOD AND DEVICE
摘要 A high-speed machine and method for placing an RFID circuit onto an electrical component includes separating an RFID circuit from a web of RFID circuits, and placing the RFID circuit onto an electrical component with a placing device. The separating includes directing the RFID circuit onto a transfer drum of the placement device and separably coupling the RFID circuit to the transfer drum. According to one method, a separator device separates and directs chips or interposers onto a placement device. According to another method, chips or interposers are tested before being separated from a web, and if good, are separated from the web, directed onto a placement device, and placed on an electrical component. If defective, the chips or interposers are not directed onto a placement device and are removed by a scrap web removal device.
申请公布号 KR101185742(B1) 申请公布日期 2012.09.26
申请号 KR20077027447 申请日期 2006.04.25
申请人 发明人
分类号 G06K19/077;G06K19/07 主分类号 G06K19/077
代理机构 代理人
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