| 摘要 |
PURPOSE: A light emitting device package is provided to improve profitability by forming a sealing unit area as air or a vacuum area. CONSTITUTION: A light emitting chip(12) is formed on a lower structure(11). A wavelength conversion layer(13) is formed on the light emitting chip. The wavelength conversion layer includes first to third wavelength conversion layers(13a,13b,13c) with different sizes of a quantum dot. The quantum dot is formed near the light emitting chip.
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