| 发明名称 |
Process for etching a recessed structure filled with tin or a tin alloy |
| 摘要 |
The invention discloses a process for planarization of recessed structures filled with tin or a tin alloy which avoids the formation of dimples. Such structures can serve as solder deposits for stable and reliable solder joints in electronic devices. |
| 申请公布号 |
EP2503029(A1) |
申请公布日期 |
2012.09.26 |
| 申请号 |
EP20110159179 |
申请日期 |
2011.03.22 |
| 申请人 |
ATOTECH DEUTSCHLAND GMBH |
发明人 |
WOOD, NEAL;TEWS, DIRK |
| 分类号 |
C23F1/40;C23F1/02;C23F1/44;H01L21/00;H01L21/306;H01L21/3213;H05K3/00;H05K3/06 |
主分类号 |
C23F1/40 |
| 代理机构 |
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代理人 |
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| 主权项 |
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