| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition capable of performing formation of a resist pattern by a direct drawing exposure method with satisfactory sensitivity and resolution; a photosensitive element using the same; a method for forming the resist pattern; and a method for producing print wiring board. <P>SOLUTION: The photosensitive resin composition contains (A) a binder polymer, (B) a photopolymerizable compound having an ethylenic unsaturated bond and (C1) a compound represented by formula (1). Here, in the formula (1), at least one of the Rs represents an isopropyl group, and the sum of a, b and c is 1-6. When the sum of a, b and c is 2-6, a plurality of Rs in the same molecule can be the same or different. <P>COPYRIGHT: (C)2010,JPO&INPIT |
