发明名称
摘要 The electronic assembly, comprising a printed circuit (1) and a housing (3, 4) that provides thermal and/or electrical insulation and has a thermal drain (2, 5, 6) with an interface layer complex. The latter is located between faces of the printed circuit and housing, extending over the major part of the printed circuit surface and having an adhesive coating on each side for attaching to the printed circuit and the housing. The housing has an additional fixing in the form of a projection (9) that engages with holes (10, 11) in the interface layer and printed circuit.
申请公布号 JP5036985(B2) 申请公布日期 2012.09.26
申请号 JP20050200777 申请日期 2005.07.08
申请人 发明人
分类号 H05K7/20 主分类号 H05K7/20
代理机构 代理人
主权项
地址