发明名称 |
WIRE WRAP COMPOSITIONS AND METHODS RELATING THERETO |
摘要 |
The present disclosure is directed to a wire wrap composition having a polyimide layer and a bonding layer. The polyimide layer is composed of a polyimide and a sub-micron filler. The polyimide is derived from at least one aromatic dianhydride component selected from rigid rod dianhydride, non-rigid rod dianhydride and combinations thereof, and at least one aromatic diamine component selected from rigid rod diamine, non-rigid rod diamine and combinations thereof. The mole ratio of dianhydride to diamine is 48-52:52-48 and the ratio of X:Y is 20-80:80-20 where X is the mole percent of rigid rod dianhydride and rigid rod diamine, and Y is the mole percent of non-rigid rod dianhydride and non-rigid rod diamine. The sub-micron filler is less than 550 nanometers in at least one dimension; has an aspect ratio greater than 3:1; is less than the thickness of the film in all dimensions. |
申请公布号 |
EP2501743(A1) |
申请公布日期 |
2012.09.26 |
申请号 |
EP20100785557 |
申请日期 |
2010.11.19 |
申请人 |
E. I. DU PONT DE NEMOURS AND COMPANY |
发明人 |
AUMAN, BRIAN, C.;DUNBAR, MEREDITH, L.;HE, TAO;KOURTAKIS, KOSTANTINOS |
分类号 |
C08G73/10;C09D179/08;H01L21/77;H01L23/14;H01L23/29;H05K1/03 |
主分类号 |
C08G73/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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