POLYIMIDE RESIN, MANUFACTURING METHOD THEREFOR, ADHESIVE RESIN COMPOSITION, COVERLAY FILM, AND CIRCUIT BOARD

摘要

Provided is a polyimide resin obtained by reacting an amino compound, said amino compound having at least two primary amino groups as functional groups, with a ketone group in a polyimide-siloxane that has constituent units represented by general formulas (1) and (2). In said formulas, Ar represents a tetravalent aromatic group derived from an aromatic tetracarboxylic acid anhydride; R1 represents a divalent diaminosiloxane residue derived from a diaminosiloxane; R2 represents a divalent aromatic diamine residue derived from an aromatic diamine; Ar and/or R2 contains a ketone group; m and n represent the molar ratio between the constituent units; m is between 0.75 and 1; and n is between 0 and 0.25.