WAFER LEVEL LED PACKAGE AND METHOD OF FABRICATING THE SAME

摘要

PURPOSE: A wafer level light emitting diode package and a manufacturing method thereof are provided to easily self-aligning a plurality of semiconductor stacked structures and through holes by aligning bumps in the through holes. CONSTITUTION: A mount substrate has a first through hole and a second through hole. A semiconductor stacked structure(30) is located on the upper part of the mount substrate. The semiconductor stacked structure has a first conductive semiconductor layer(25), a second conductive semiconductor layer(29) and an active layer(27). A first combiner(55a) electrically connects a first lead electrode(53a) and the first conductive semiconductor layer. A second combiner(55b) electrically connects a second lead electrode(53b) and the second conductive semiconductor layer.