发明名称 |
APPARATUS AND METHOD FOR INSPECTING PRINTED CIRCUIT BOARDS |
摘要 |
PURPOSE: A device and a method for an optical inspection of a printed circuit substrate are provided to reduce inspecting time because various inspections can be performed with one process and to determine the existence of failure at high accuracy through a detail image analysis with respect to a printed circuit board. CONSTITUTION: A device(100) for an optical inspection of a printed circuit substrate comprises a camera(120), a template storing unit(140), an image arranging unit(130), and a first inspecting unit. The template storing unit records reference images photographed in advance. The image arranging unit set reference coordinates of the images photographed based on the reference images, thereby arranging the photographed images. The first inspecting unit compares the arranged images with the reference images, thereby inspecting the failure of patterns on a printed circuit board. [Reference numerals] (100) Optical inspection device; (105) Memory; (120) Camera; (130) Image aligning unit; (140) Template storing unit; (150) Image inspecting unit; (160) Transmission inspecting unit; (AA) Inspection object; (BB) Inspection result |
申请公布号 |
KR20120105863(A) |
申请公布日期 |
2012.09.26 |
申请号 |
KR20110023550 |
申请日期 |
2011.03.16 |
申请人 |
SAMSUNG TECHWIN CO., LTD. |
发明人 |
PARK, YUN WON;HWANG, YOUNG BAE;JUNG, JAE HO;YEO, SEUNG MOON;PARK, JU HYEONG |
分类号 |
G01N21/956;G01B11/24;H05K13/08 |
主分类号 |
G01N21/956 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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