| 摘要 |
<p>A polishing apparatus is used for polishing a substrate such as a semiconductor wafer to a flat mirror finish. The polishing apparatus includes a polishing table (100) having a polishing surface (101a), a top ring body (2,200) configured to hold and press a substrate W against the polishing surface, a retainer ring (3) provided at an outer peripheral portion of the top ring body (2,200) and configured to press the polishing surface, and a retainer ring guide (410) fixed to the top ring body and configured to be brought into sliding contact with a ring member (408,408a) of the retainer ring to guide a movement of said ring member.
Either sliding contact surfaces of the ring member and the retainer ring guide are brought into sliding contact with each other, wherein said sliding contact surfaces of said ring member and said retainer ring guide are coated with lubricant, and a connection (420) sheet is provided between an outer circumferential surface of said ring member and said retainer ring guide,
or a low friction material member (602) is provided on an outer circumference of said ring member of said retainer ring to bring said low friction material member into sliding contact with said retainer ring guide.</p> |
