发明名称 APPARATUS AND METHOD FOR CONTROLLABLY IMPLANTING WORKPIECES
摘要 <p>A plasma processing apparatus comprises a plasma source configured to produce a plasma in a plasma chamber, such that the plasma contains ions for implantation into a workpiece. The apparatus also includes a focusing plate arrangement having an aperture arrangement configured to modify a shape of a plasma sheath of the plasma proximate the focusing plate such that ions exiting an aperture of the aperture arrangement define focused ions. The apparatus further includes a processing chamber containing a workpiece spaced from the focusing plate such that a stationary implant region of the focused ions at the workpiece is substantially narrower that the aperture. The apparatus is configured to create a plurality of patterned areas in the workpiece by scanning the workpiece during ion implantation.</p>
申请公布号 EP2502254(A1) 申请公布日期 2012.09.26
申请号 EP20100788436 申请日期 2010.11.17
申请人 VARIAN SEMICONDUCTOR EQUIPMENT ASSOCIATES, INC. 发明人 RENAU, ANTHONY;GODET, LUDOVIC;MILLER, TIMOTHY, J.;OLSON, JOSEPH, C.;SINGH, VIKRAM;BUONODONO, JAMES;RAMAPPA, DEEPAK;LOW, RUSSELL, J.;GUPTA, ATUL;DANIELS, KEVIN, M.
分类号 H01J37/317;C23C14/48;H01J37/32;H01L21/265;H01L21/266 主分类号 H01J37/317
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