发明名称 |
CAMERA MODULE AND THE FABRICATING METHOD THEREOF |
摘要 |
PURPOSE: A camera module and a manufacturing method thereof are provided to prevent deformation of a circuit board by forming an image sensor groove and to increase the resolution of a camera module. CONSTITUTION: A lens unit includes at least one lens. An image sensor(130) is installed on a lower side of the lens unit. A plurality of electric components is installed in a circuit board(140). A circuit pattern layer is formed on the circuit board. The circuit pattern layer electrically connects the image sensor and an electronic device.
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申请公布号 |
KR20120106018(A) |
申请公布日期 |
2012.09.26 |
申请号 |
KR20110023826 |
申请日期 |
2011.03.17 |
申请人 |
SAMSUNG TECHWIN CO., LTD. |
发明人 |
LEE, SANG RYEOL |
分类号 |
H04N5/225;G03B17/02 |
主分类号 |
H04N5/225 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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