发明名称 CAMERA MODULE AND THE FABRICATING METHOD THEREOF
摘要 PURPOSE: A camera module and a manufacturing method thereof are provided to prevent deformation of a circuit board by forming an image sensor groove and to increase the resolution of a camera module. CONSTITUTION: A lens unit includes at least one lens. An image sensor(130) is installed on a lower side of the lens unit. A plurality of electric components is installed in a circuit board(140). A circuit pattern layer is formed on the circuit board. The circuit pattern layer electrically connects the image sensor and an electronic device.
申请公布号 KR20120106018(A) 申请公布日期 2012.09.26
申请号 KR20110023826 申请日期 2011.03.17
申请人 SAMSUNG TECHWIN CO., LTD. 发明人 LEE, SANG RYEOL
分类号 H04N5/225;G03B17/02 主分类号 H04N5/225
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