A chemical mechanical polishing (cmp) composition comprising a polymeric polyamine

摘要

A chemical-mechanical polishing (CMP) composition comprising
(A) inorganic particles, organic particles, or a composite or mixture thereof,
(B) a polymeric polyamine or a salt thereof comprising at least one type of pendant group (Y) which comprises at least one moiety (Z),
wherein (Z) is a carboxylate (-COOR 1 ), sulfonate (-SO 3 R 2 ), sulfate (-O-SO 3 R 3 ), phosphonate (-P(=O)(OR 4 )(OR 5 ) ), phosphate (-O-P(=O)(OR 6 )(OR 7 ) ), carboxylic acid (-COOH), sulfonic acid (-SO 3 H), sulfuric acid (-O-SO 3 - ), phosphonic acid (-P(=O)(OH) 2 ), phosphoric acid (-O-P(=O)(OH) 2 ) moiety, or their deprotonated forms,
R 1 is alkyl, aryl, alkylaryl, or arylalkyl
R 2 is alkyl, aryl, alkylaryl, or arylalkyl,
R 3 is alkyl, aryl, alkylaryl, or arylalkyl,
R 4 is alkyl, aryl, alkylaryl, or arylalkyl,
R 5 is H, alkyl, aryl, alkylaryl, or arylalkyl,
R 6 is alkyl, aryl, alkylaryl, or arylalkyl,
R 7 is H, alkyl, aryl, alkylaryl, or arylalkyl,
and
(C) an aqueous medium.