发明名称 |
BGA footprint pattern for increasing number of routing channels per PCB layer |
摘要 |
A printed circuit board (PCB) includes a ball grid array (BGA). The PCB further includes a first BGA pad having a circular shape, and a first via having a circular shape, where the circular shape of the first via overlaps a portion of the circular shape of the first BGA pad and is rotated diagonally relative to a center of the first BGA pad. The PCB also includes a second BGA pad having a circular shape, and a second via having a circular shape, where the circular shape of the second via overlaps a portion of the circular shape of the second BGA pad and is rotated diagonally relative to a center of the second pad, and where a center of the second via is located at a first distance from the center of the first via and at a first angle relative to an axis that crosses a center of the first via. |
申请公布号 |
US8273994(B2) |
申请公布日期 |
2012.09.25 |
申请号 |
US20090647737 |
申请日期 |
2009.12.28 |
申请人 |
REYNOV BORIS;YUE PING;SIDDHAYE SHREERAM;CLEVELAND JOHN;SRINIVAS CHEBROLU;VENKATARAMAN SRINIVAS;JUNIPER NETWORKS, INC. |
发明人 |
REYNOV BORIS;YUE PING;SIDDHAYE SHREERAM;CLEVELAND JOHN;SRINIVAS CHEBROLU;VENKATARAMAN SRINIVAS |
分类号 |
H05K1/11;H05K1/18;H05K7/00 |
主分类号 |
H05K1/11 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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