发明名称 METHOD FOR MAKING CERAMIC CHIP BODY AND CERAMIC CHIP ELEMENT MADE BY THE SAME
摘要 PURPOSE: A method for manufacturing a ceramic chip body and a ceramic chip component applying the same are provided to protect the ceramic chip body against the change of an external environment by forming an insulation coating layer on the surface of a ceramic plastic body. CONSTITUTION: A polymer coating layer of liquid polymer is formed on the surface of a ceramic plastic body(140) with electric performance. A power coating layer of thermal fusible insulation powder is formed on the surface of the polymer coating layer. The ceramic plastic body is thermally processed. An insulation coating layer(120) is formed on the surface of the ceramic plastic body.
申请公布号 KR101185892(B1) 申请公布日期 2012.09.25
申请号 KR20110093692 申请日期 2011.09.16
申请人 KIM, SUN KI;JOINSET CO., LTD. 发明人 KIM, SUN KI
分类号 H01G4/12;H01C7/10;H01G4/30 主分类号 H01G4/12
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