发明名称 HIGH TEMPERATURE CHUCK AND METHOD OF USING SAME
摘要 Improved resistance to temperature-related degradation or deformation in a wafer-supporting chuck is provided by at least one shielding member that physically and/or thermally shields chuck components from effects of elevated temperature processing fluids.
申请公布号 KR20120105475(A) 申请公布日期 2012.09.25
申请号 KR20127015640 申请日期 2010.12.02
申请人 LAM RESEARCH AG 发明人 BRUGGER MICHAEL;LACH OTTO
分类号 H01L21/687;H01L21/683 主分类号 H01L21/687
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