发明名称 |
Semiconductor substrate, laminated chip package, semiconductor plate and method of manufacturing the same |
摘要 |
A semiconductor substrate has a plurality of groove portions formed along scribe lines. The semiconductor substrate includes: insulating layers formed in the plurality of groove portions; a rectangular unit region in contact with at least any one of the plurality of groove portions; and a wiring electrode including an extended terminal portion extended from the unit region to the inside of the groove portion. The semiconductor substrate is manufactured by forming a plurality of groove portions along scribe lines; embedding an insulating material in the plurality of groove portions and planarizing a surface to form insulating layers; and forming a wiring electrode including an extended terminal portion extended from a rectangular unit region in contact with at least any one of the plurality of groove portions to the inside of the groove portion. |
申请公布号 |
US8274165(B2) |
申请公布日期 |
2012.09.25 |
申请号 |
US20090368643 |
申请日期 |
2009.02.10 |
申请人 |
SASAKI YOSHITAKA;ITO HIROYUKI;IIJIMA ATSUSHI;HEADWAY TECHNOLOGIES, INC.;SAE MAGNETICS (H.K.) LTD. |
发明人 |
SASAKI YOSHITAKA;ITO HIROYUKI;IIJIMA ATSUSHI |
分类号 |
H01L23/544 |
主分类号 |
H01L23/544 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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