发明名称 Socket and semiconductor device including socket and semiconductor package
摘要 A socket includes: a circuit board; a plurality of connection terminals disposed on the circuit board; a plurality of contacts each fixed to a corresponding one of the connection terminals, wherein each of the contacts is formed of a conductive elastic member, each of the contacts comprising: a tail portion fixed to the corresponding connection terminal; an extending portion connected to the tail portion and extending in a direction substantially parallel with a surface of the circuit board; a rise portion connected to the extending portion and extending in a direction substantially perpendicular to the surface of the circuit board; and a tip portion connected to the rise portion.
申请公布号 US8272880(B2) 申请公布日期 2012.09.25
申请号 US201113029822 申请日期 2011.02.17
申请人 TANAKA MASATO;SHINKO ELECTRIC INDUSTRIES CO., LTD. 发明人 TANAKA MASATO
分类号 H01R12/00 主分类号 H01R12/00
代理机构 代理人
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