A method of filling copper in a non-through hole on a substrate that has been treated to render it conductive, which comprises plating said substrate in an acidic copper plating bath comprising a water-soluble copper salt, sulfuric acid and a filling additive that is a polymer having the activities of both of a brightener and a leveler.
申请公布号
US8273232(B2)
申请公布日期
2012.09.25
申请号
US20100753530
申请日期
2010.04.02
申请人
OKAMOTO NAOKI;KONDO KAZUO;KURI HIDEYUKI;BUNYA MASARU;TAKEUCHI MINORU;OSAKA PREFECTURE UNIVERSITY PUBLIC CORPORATION;NITTO BOSEKI CO., LTD.