| 发明名称 |
Adhesive for bonding circuit members, circuit board and process for its production |
| 摘要 |
An adhesive for bonding and securing a semiconductor chip to a circuit board and electrically connecting the electrodes of the two, and containing an adhesive resin composition and an inorganic filler being contained in an amount of 10 to 200 parts by weight of 100 parts by weight of the adhesive resin composition.
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| 申请公布号 |
US8273457(B2) |
申请公布日期 |
2012.09.25 |
| 申请号 |
US201113166570 |
申请日期 |
2011.06.22 |
| 申请人 |
WATANABE ITSUO;TAKEMURA KENZO;NAGAI AKIRA;ISAKA KAZUHIRO;WATANABE OSAMU;KOJIMA KAZUYOSHI;HITACHI CHEMICAL COMPANY, LTD. |
发明人 |
WATANABE ITSUO;TAKEMURA KENZO;NAGAI AKIRA;ISAKA KAZUHIRO;WATANABE OSAMU;KOJIMA KAZUYOSHI |
| 分类号 |
B32B27/38;C09J9/02;H01L21/60;H01L23/498;H05K3/32 |
主分类号 |
B32B27/38 |
| 代理机构 |
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