| 摘要 |
The present disclosure provides for a circuit package that can include a signal input port that receives an electronic signal that includes multiple frequency components and a signal output port that outputs the electronic signal. The circuit package can include a trace having multiple portions that have a portion-dependent impedance. The trace can transfer the electronic signal from the signal input port to the signal output port. The present disclosure provides an apparatus to compensate a package trace parasitics, such as parasitic capacitance, to improve signal fidelity over a predetermined frequency range. The apparatus can provide a broadband impedance matching structure that matches the impedance of an I/O cell to the impedance of a printed circuit board and can compensate for the parasitic effects of both the I/O cell, terminals, and other discontinuities that may be present within the package.
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