| 摘要 |
<p>PURPOSE: A printed circuit board, a printed circuit board unit, an electronic apparatus, and a method for manufacturing the printed circuit board are provided to control generation of a stub by forming a cylindrical via along an inner wall of a though hole. CONSTITUTION: Conductive layers(21-25) is alternatively laminated with an insulating layer. A though hole(60) passes through the conductive layer and the insulating layer. A first plating resist part(50) is formed on a wall of the through hole. Plating parts(30A,30B,30C) are formed on the inner wall of the through hole excluding the first plating resist part. A via(40) and the plating resist part are formed into a cylindrical shape along the inner wall of the through hole. [Reference numerals] (AA) Figure of showing a cross-sectional structure of a wiring unit in an embodiment 1</p> |
