发明名称 |
SEMICONDUCTOR WAFER CHIP INSPECTION AND SORT SYSTEM |
摘要 |
PURPOSE: A semiconductor wafer chip test system including a picking apparatus is provided to increase inspection speed for a semiconductor chips by simultaneously transferring two semiconductor chips. CONSTITUTION: A wafer loader(100) gradually provides a wafer by mounting a wafer cassette including the wafer. A picking unit(120) simultaneously transfers two semiconductor chips using two nozzles. An index rail(200) moves the semiconductor chips by receiving the semiconductor chips through a chip mounting frame. A first test apparatus(220) tests one of the semiconductor chips which are moved through the index rail. A second test apparatus(240) tests another semiconductor chip which is not tested by the first test apparatus. [Reference numerals] (100) Wafer loader; (110) Wafer cassette; (120) Picking unit; (200) Index rail; (210) First chip arrangement unit; (220) First test apparatus; (230) Second chip arrangement unit; (240) Second test apparatus; (250) Pick up apparatus; (260) Transfer; (300) Pick up apparatus; (AA) Buffer stage; (BB) Wafer stage; (CC) Classification stage |
申请公布号 |
KR20120105120(A) |
申请公布日期 |
2012.09.25 |
申请号 |
KR20110022711 |
申请日期 |
2011.03.15 |
申请人 |
3PI |
发明人 |
SONG, HYUN;KIM, JAE KWANG |
分类号 |
G01R31/26;H01L21/66 |
主分类号 |
G01R31/26 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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