| 发明名称 |
Method of fabricating a semiconductor package using a fluxing underfill composition applied to solder balls in a dip process |
| 摘要 |
The present invention relates to a method of fabricating a semiconductor package or circuit assembly using an fluxing underfill composition applied to solder contact points in a dip process.
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| 申请公布号 |
US8273606(B2) |
申请公布日期 |
2012.09.25 |
| 申请号 |
US20100884405 |
申请日期 |
2010.09.17 |
| 申请人 |
CHAN CHEW B.;JI QING;CURRIE MARK;POOLE NEIL;KELLY GERALDINE;HENKEL CORPORATION;HENKEL LTD |
发明人 |
CHAN CHEW B.;JI QING;CURRIE MARK;POOLE NEIL;KELLY GERALDINE |
| 分类号 |
H01L21/00;B05D1/18 |
主分类号 |
H01L21/00 |
| 代理机构 |
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| 主权项 |
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